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Taiwan Semiconductor Online Seminar
09 Sep 2026 08:00-11:30
Explore Study and Career Opportunities in Taiwan’s Semiconductor Industry
Students, graduates and professionals interested in semiconductor technologies are invited to join the 2026 Taiwan Semiconductor Online Seminar – Working & Studying in Taiwan on 9 September 2026. The online event will introduce Taiwan’s semiconductor ecosystem and provide an overview of current career opportunities, study programmes and scholarships available to international talent.
The seminar will bring together six leading semiconductor companies – UMC, Realtek, SPIL, USI, NANYA and OSE – and four leading STEM universities in Taiwan: National Taiwan University (NTU), National Yang Ming Chiao Tung University (NYCU), National Tsing Hua University (NTHU) and National Cheng Kung University (NCKU).
Participants will have the opportunity to learn more about career prospects in Taiwan’s semiconductor industry as well as further study and scholarship opportunities. The seminar will also introduce Taiwan’s international talent support system and share experiences of international students and professionals currently studying and working in Taiwan.
The event is particularly suitable for Bachelor’s, Master’s and Ph.D. students and graduates, as well as professionals with engineering or semiconductor-related backgrounds. English communication skills are required; basic knowledge of Chinese is an advantage but is not mandatory.
Participants are also welcome to submit their CV during registration. Following the event, submitted CVs will be reviewed by the participating organisations and companies. Candidates whose profiles match specific recruitment requirements may be contacted directly by the respective recruitment units regarding potential next steps. Please note that participation in the seminar or submission of a CV does not guarantee further recruitment opportunities.
Registration link:https://www.surveycake.com/s/krPAZ
- Online event URL
- https://www.surveycake.com/s/krPAZ
- Contact person
- doc. Ing. Radoslav Bortel, Ph.D., bortelr@fel.cvut.cz
- Attachment
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