Akce ČVUT

Manufacturable Heterogeneous Integration of Compliant CMOS Electronics for Interactive Systems

04.09.2018   10:00

Prof. Muhammad Mustafa Hussain:
Can be CMOS technology expanded further to achieve new features in CMOS electronics while maintaining and/or strengthening existing attributes? Will the functionalities over cost be advantageous? Can the existing applications be further strengthened and/or diversified? What potential applications may emerge? He will discuss rational design of materials, processes and devices to develop robust manufacturing processes through
heterogeneous integration of state-of-the-art CMOS technologies to transform conventional high performance but rigid CMOS electronics into fully compliant one; various printing techniques (inkjet for interconnects, 3D printing for encapsulation); electrochemical deposition (ECD) for through polymer via (TPV); automated transfer; Lego like lock and key assembly; non-functionalized household papers and other responsive materials based sensors and actuators, respectively and finally their roll-to-roll processing to achieve nature inspired fully compliant in-plane and out-of-plane CMOS electronics for emerging IoE applications. I will also show a few examples on our extensive work on interactive electronic system and discuss their design criteria as a new
generation of add-on, wearable and implantable electronics.

Místo konání

Technicka 2, Prague 6, room no. 80

Kontaktní osoba

doc. RNDr. Jan Voves, CSc., voves@fel.cvut.cz