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Taiwan – Europe Chip Innovation Forum
27.11.2025-28.11.2025 08:30-18:40
Cultivating global talent for the future of semiconductors.
As semiconductor technologies continue to evolve and reshape the global landscape, Taiwan–Europe collaboration has become a key driver of innovation. Hosted by National Institutes of Applied Research (NIAR), imec, Europractice, and TU Dresden (TUD), the Taiwan–Europe Chip Innovation Forum 2025 focuses on Technology Innovation, Talent Cultivation, and Cross-regional Collaboration, bringing together leaders from industry, academia, and policy to explore the future of chip technologies.
Featuring keynote presentations by ESMC and Synopsys, the forum covers Advanced Packaging, Silicon Photonics, Smart Sensing, Advanced Devices, and Emerging Memory, while placing a strong emphasis on developing semiconductor talent, showcasing a comprehensive approach from technology to workforce. By fostering knowledge sharing and partnerships, the forum serves as a vital platform for sustainable semiconductor innovation and talent cultivation worldwide.
- Místo konání
- Hotel Taschenbergpalais Kempinski Dresden
- URL online akce
- https://tecif.eu/
- Pořadatel
- TSRI Taiwan
- Kontaktní osoba
- Ing. Vladimír Janíček, Ph.D., janicev@fel.cvut.cz, +420224355854
- Podrobnější informace
- https://tecif.eu/